ASMADE cordially invites you to SEMICON CHINA 2025.

From March 26th to 28th, 2025, ASMADE will showcase new semiconductor die bonding solutions in the fields of semiconductor packaging, optical module packaging, and power device packaging at Booth 6179 in Hall E6. We hope to see you there!

Exhibited Products

AS8136 High Precision Semiconductor Die Bonder
Semiconductor Packaging | Turret Bonding | ±3μm
Application: Optical Modules, LiDAR, Sensors, SIP, Chiplet

AS8123 Epoxy Die Bonder
Semiconductor Packaging | 4 Spot Epoxy Mechanism | Suitable for Multi-dimensional Wafers
Application: Sensors, SIP, Chiplet, IC, Silver Paste Process Power Devices, MOS

AS3601 Pixel Die Bonder

Pixel Die Bonding Technology | RGB 36Rings Mixed-Bond | UPH 90K/H
Application：Mini LED COB

ASMADE is committed to the innovation, adheres to independent research and development, and its core technical team consists of process, control, and mechanism parts. Dedicated to providing one-stop semiconductor packaging process die bond solutions. The machines have independent intellectual property rights.

We look forward to meeting you at the exhibition to share experiences, discuss cooperation, and create a better future together!