Mini LED Intelligent Manufacturing Line
2024-10-14(2933)Browse
Mini LED Intelligent Manufacturing Line
I. Parallel manufacturing line
Intensified Space, Multi-Machine ConcurrentManufacture,High Product Utilization Rate
II. Intelligent Manufacturing
Customized MES System,Console Management, Artificial Intelligence Task Allocation, Self -Directed Learning, Intelligent Early Warning, Minimize Human Intervention
III. Technical Service
Senior Motion Control Expert in the Industry
Senior Process Engineering Expert in the Industry
Packaging Technology (Management System)
· Manufacture average · Yield Statistics
· Real-time Manufacture Data Reporting
· Statistics of first-pass yield
· CPK Statistics for Printing Process
· Machine status in the die bonding process
New Information
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On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
The world's first semiconductor chip-level printer with ...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
The Epoxy Die Bonder is a semiconductor machine that feature...
0755-29691921
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
0755-29691921